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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

£108.00
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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
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This book presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues s: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI).

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